元器件交易网讯  3月21日消息，据业内人士透露，慧荣科技和群联电子已经获取闪迪公司发布的USB 3.0闪存驱动器以及eMMC模块订单。

　　慧荣科技已与台湾半导体制造公司（TSMC）合作生产过固态硬盘控制芯片、NAND快闪记忆体卡和闪存驱动器，这一次该公司将会生产55纳米级eMMC控制芯片。该eMMC控制芯片的工艺将在2014年第三季度到达40nm。慧荣科技将在第二季度向闪迪供货eMMC控制器芯片。（元器件交易网  白玉涛译）

　　以下为外文：

　　Silicon Motion and Phison Electronics reportedly have landed controller chip orders for eMMC modules and USB 3.0 flash drives, respectively, from SanDisk, according to industry sources.

　　Silicon Motion, which has been cooperating with Taiwan Semiconductor Manufacturing Company (TSMC) for production of controller chips for SSDs, eMMC modules, NAND flash memory cards and flash drives, will produce SanDisk's eMMC controller chips using a 55nm node, said the sources.

　　The production of the eMMC controller chips will migrate to a 40nm process node in the third quarter of 2014, said the sources, adding that Silicon Motion is to begin shipping eMMC controller chips to SanDisk in the second quarter.