元器件交易网讯  3月19日消息，据外媒报道，业内人士称，从2014年第二季度起，美光科技将向台湾IC测试和包装公司提供更多的DRAM芯片后端包装订单。

　　消息人士说，美光马来西亚工厂目前推出了标准DRAM芯片， 但工厂计划将产品从DRAM芯片转移到NAND闪存，因此它需要更多台湾外包包装商。

　　消息人士称，美光正在确认大批台湾后端服务公司，该流程将于第一季度底完成。

　　消息称，日月光半导体(Advanced Semiconductor Engineering，ASE)将与美光在西安建立一个联合包装和测试工厂，因此它可能从美光获得大批订单。

　　然而，其他后端服务公司包括力成科技(Powertech Technology)、ChipMOS和华东科技(Walton Advanced Engineering)也有机会从美光赢得新订单，因为它们主要也向美国内存芯片制造商提供标准DRAM、移动DRAM和NAND闪存芯片后端服务。

　　（元器件交易网董蕾 译）

　　外媒原文如下：

　　Micron Technology reportedly plans to release more backend packaging orders for its commodity DRAM chips to Taiwan-based IC testing and packaging companies starting the first half of the second quarter of 2014, according to industry sources.

　　Micron is currently rolling out standard DRAM chips from its plant in Malaysia but plans to switch the plant's production from DRAM chips to NAND flash products, and therefore it needs to outsource packaging capacity to Taiwan, the sources noted.

　　For the outsourcing plan, Micro is undertaking validation at a number of backend service firms in Taiwan, with the process slated for completion at the end of the first quarter, said the sources.

　　Advanced Semiconductor Engineering (ASE) reportedly will team up with Micron to set up a joint packaging and testing fab in Xian, China, and therefore it is situated to land windfall orders from Micron, the sources commented.

　　However, other backend services companies including Powertech Technology (PTI), ChipMOS Technologies and Walton Advanced Engineering also have chances to win new orders from Micron since they are also providing the US-based memory chipmaker with backend services mainly for standard DRAM, mobile DRAM and NAND flash memory chips, added the sources.