元器件交易网讯  6月25日消息，据外媒报道，台积电董事长张忠谋表示，台积电将在第三第四季度全部投产，第三季度收入将来自20纳米工艺，占总收入的10%，第四季度将上涨20%。

　　张忠谋在公司最近的股东会议上表示，未来五年预计全球半导体行业将在每年增长3%-5%，但台积电增长率将高于行业的平均水平。

　　2013年台积电将生产1567万片8英寸等价晶圆，去年为1404万。另外，40/45纳米及以下的工艺当前占台积电总收入的50%以下。

　　台积电当前16纳米FinFET工艺总共有超过20个流片的用户。

　　同时，台积电计划建立一个特殊的研发部门，这将由300-400个技术人员组成，开发10纳米工艺，旨在推动这个工艺在2015年进入试产，2016年开始量产。

　　（元器件交易网董蕾 译）

　　外媒原文如下：

　　Taiwan Semiconductor Manufacturing Company (TSMC) will operate at full capacity in the third and fourth quarters, with revenues generated from 20nm processes to account for 10% of total revenues in the third quarter and rise to 20% in the fourth, according company chairman Morris Chang.

　　The global semiconductor industry is expected to grow 3-5% annually in the next five years, but TSMC's growth rates will be higher than the industry average, Chang said at the company's latest shareholders meeting.

　　TSMC's wafer production reached 15.67 million 8-inch equivalent wafers in 2013 compared to 14.04 million units a year earlier, said the company, adding that 40/45nm and below processes currently account for 50% of TSMC's total revenues.

　　TSMC currently has a total of over 20 tape-out clients for its 16nm FinFET process, the company noted.

　　Meanwhile, TSMC plans to set up a special R&D unit, which will be powered by 300-400 technicians, to develop 10nm processes, aiming to push the process into trial production in 2015 and mass production in 2016.