元器件交易网讯  5月12日消息，据外媒报道，蓝牙芯片组在2012年打破一年一度10亿颗的出货量，并计划在2015年达到30亿颗、 2018年达到40亿颗。

　　十年期间蓝牙芯片已经得到巨大发展，从手机和耳机扩展到众多个人设备、配件和家庭自动化设备。ABI Research预测包括蓝牙、“蓝牙+无线网络+ FM”在内的芯片组将在2014年作为最高出货量组合。未来五年内，智能蓝牙出货量将会大增。（元器件交易网 白玉涛译）

　　以下为外文：

　　Bluetooth shipments broke an annual two billion shipments in 2012 and are set to surpass three billion shipped during 2015 and four billion during 2018. "Cumulatively, over 19 billion chipsets will ship over the next five years," stated ABI research director Philip Solis. "Of various integration levels, standalone Bluetooth chipsets will be the largest group in 2019 followed by combo chipsets with Bluetooth and then integrated platforms with Bluetooth."

　　"During that time, Bluetooth Smart Ready will experience steady growth, while Bluetooth Smart will grow rapidly, and Bluetooth 'Classic' will fade away."

　　The market for Bluetooth chipsets has evolved greatly over the past decade, expanding from phones and headsets to a multitude of personal devices, accessories, and home automation devices. Of the ten different combo chipset combinations ABI Research forecasts that include Bluetooth, "Bluetooth + Wi-Fi + FM" chipsets will be the highest shipping combo type in 2014 as well as 2019. In 2014 this combo type will have a larger share compared to 2019 as other combo types ramp up over the next five years, said ABI Research.

　　"Bluetooth Smart Ready will have the majority of shipments over the next five years compared to Bluetooth Smart and Bluetooth Classic," added Solis. "During that time, Bluetooth Smart Ready will experience steady growth, while Bluetooth Smart will grow rapidly, with Bluetooth 'Classic' fading away." Broadcom, CSR, TI, Qualcomm Atheros, MediaTek, and others are well positioned to capitalize on this growth.