元器件交易网讯 4月23日消息，据来自上游供应链的消息，南亚电路板PCB和集成电路衬底产能利用率预计将在2014年第二季度上升。

　　销售火爆的游戏机、4G LTE服务器、基站和手持设备将促进市场对FC BGA和CSP FC基板的需求。

　　南亚科技在2014年做出6600万美元预算，其中大量新资金被用来投入FC CSP基板。南亚科技正计划到2014年底，减小PCB收入使之占销售总额的30%，而IC基板产品的比率为70％。 （元器件交易网   白玉涛译）

　　以下为外文：

　　The capacity utilization rates of Nanya PCB's PCB and IC substrate lines are expected to climb higher in the second quarter of 2014 compared to the previous quarter, buoyed by orders from non-PC sectors, including networking devices, handsets and games consoles, according to industry sources.

　　Booming sales of games consoles, 4G LTE servers, base stations and handheld devices will help drive up demand for FC BGA and FC CSP substrates as well as multi-layer boards, said the sources.

　　Nanya has set a capex budget of NT$2 billion (US$66.16 million) for 2014, with the bulk of the new capital to be used to ramp up its FC CSP substrates in the year, added the sources.

　　The EOL of Windows XP is likely to trigger replacement demand for PCs , which will be instrumental for Nanya to boost sales of PCBs, although the PCB maker has reduced its PCB revenues to 50% of total sales, noted the sources.

　　Nanya plans to further reduce PCB revenues to 30% of its total sales by the end of 2014, while ramping the ratio of IC substrate products to 70%, added the sources.