元器件交易网讯 4月23日消息，据来自上游供应链的消息，包括日本古河电工集团与台众科技（CCI）在内的散热模组制造商正在试图减少现有智能移动设备0.6毫米热管厚度，使之达到0.45毫米。这些制造商预计智能移动设备市场与平板电脑会有15%普及这种热管。

　　微软即将推出的Surface 3平板电脑采用的是0.6毫米热管进行散热，而索尼的Xperia Z2采用古河电工的超薄热管。

　　CCI已经开始出货这种0.6毫米热管，并希望0.6到0.8毫米这种款式成为2014年移动设备主流散热模组，CCI月产能预计于5月底将达到150万件。

　　CCI指出，2013年全球热管的出货量为5000万件，0.8mm为1000万件。在2014年，0.6毫米热管有机会超过1000万件，占总数6000万件的16％。（元器件交易网   白玉涛译）

　　以下为外文：

　　Cooling module makers such as Japan-based Furukawa Electric Group and Fujikura and Taiwan-based Chaun-Choung Technology and Taisol Electronics, are looking to reduce the thickness of their existing 0.6mm heat pipes for smart mobile devices by 25% and the new heat pipe is expected to enjoy a penetration rate of over 15% in the smart mobile device market with orders from tablets and smartphones, according to sources from the upstream supply chain.

　　The sources pointed out that heat pipes are made by copper and need enough thickness to maintain their shape. They started mass producing 0.8mm heat pipes in 2013 and will start mass productions of 0.6mm one in 2014.

　　Microsoft's upcoming Surface 3 tablet adopts a 0.6mm heat pipe for cooling, while Sony's Xperia Z2 has adopted ultra-thin heat pipes from Furukawa and Fujikura.

　　CCI has already started shipping its 0.6mm heat pipes and expects 0.6mm-0.8mm models to become the mainstream cooling modules for mobile devices in 2014. CCI's monthly capacity is expected to reach 1.5-2 million units by the end of May.

　　CCI pointed out that global heat pipe shipments were about 50 million units in 2013 with 0.8mm models accounting for 10 million units. In 2014, 0.6mm models will take over 0.8mm models' position and also have a chance to reach 10 million units, accounting for 16% of global annual shipments of 60 million units.