元器件交易网讯 3月21日消息,据外媒报道,IC Insights预测了2014年前25家半导体公司的资本支出。预计三星和英特尔2014年将各自支出至少110亿美元,台积电略低于100亿美元。这三家公司今年支出预计将占半导体产业资本支出总额的51.8%。
前10大半导体公司的支出如图所示。在前10大半导体公司中,有6家预计今年将支出至少30亿美元,9家供应商预计将支持超过10亿美元。2013年它们总支出平平,2014年前10大支出公司预计将增加10%的资本支出。
在2012年和2013年分别削减资本支出28%和12%后,
两家公司今年的资本支出预算预计将增加10亿美元或更多。美光预计将增加11.2亿美元。这种支出预计将增长58% 低于去年公司销售收入增长的88%(包含尔必达的销售收入)。另外,纯晶圆厂格罗方德预计将增加10亿美元的半导体资本支出。
SK海力士预计今年支出将增长18%。然而,考虑到公司2013年优秀的销售业绩(增长43%),以及其积极的重建中国DRAM晶圆厂的计划,IC insight认为这预算有潜在上升的可能。
一些最引人注目的数字,是三星和英特尔在2012 - 2014年大量的支出。在这三年时间里,三星预计将支出353亿美元,其中约60%资金用于内存生产。英特尔预计将是第二个支出最大的公司,其资本支出预计达到326亿美元。每个公司巨大的开支水平足以建造和装备8到9个40亿美元的先进300 mm晶圆厂。
十大半导体公司有九个预计今年增加半导体资本支出。相比之下,只有4个公司在2013年增加了其支出水平。同时,“其他”供应商资本支出在预计今年增长速度低于3%,相对于2013年“其他”部门15%的下降速度,这是一个明显改善。从长远来看,IC Insights认为,“其他”公司可能会以较低的速率增加他们的支出,以更高的速率减少他们的支出,与前10家公司相比,它们的集成电路生产将实现无晶圆厂或者是轻晶圆厂(
(元器件交易网董蕾 译)
外媒原文如下:
IC Insights’ soon-to-be-released March Update to The 2014 McClean Report provides a forecast ranking of the top 25 semiconductor capital spenders for 2014. A preview of the top 10 spenders is shown in Figure 1.
After chopping its capital spending by 28% in 2012 and 12% in 2013, SanDisk is forecast to show the largest capital spending percentage increase (86%) among the top 10. The company stated that this large increase is needed to expand production of advanced 3D NAND flash memory with its manufacturing partner Toshiba. While SanDisk’s capital spending level is expected to be much higher than in 2013, this increased spending is not expected to result in a significant boost to its NAND flash capacity levels. It is worth noting that the combined capex spending increase of Toshiba and SanDisk (on account of their joint venture partnership to build flash memory) is forecast to be $1.06 billion in 2014.
Capital spending budgets are forecast to increase by $1.0 billion or more at two companies.
SK Hynix is expected to display an 18% increase in spending in 2014. However, given the company’s excellent sales performance in 2013 (43% growth) and its aggressive rebuilding program for its fire-damaged China DRAM fab, IC Insights believes there is potential upside to this estimate.
Some of the most eye-catching numbers are the massive amounts of spending expected by Samsung and Intel over the 2012-2014 timeperiod. Over this three-year period, Samsung is forecast to spend $35.3 billion, with about 60% of this amount targeting memory production. Intel is forecast to be second to Samsung in total outlays over this same time with $32.6 billion in dedicated to capital expenditures. These huge levels of spending are enough for each company to construct and equip eight or nine $4.0 billion leading-edge 300mm wafer fabs.
Nine of the top 10 semiconductor industry capital spenders are expected to increase their semiconductor capital expenditures in 2014. In contrast, only 4 of the top 10 capital spenders increased their spending levels in 2013. Meanwhile, capex spending among “other” suppliers is expected to grow at a much slower 3% rate this year, which is a marked improvement from the 15% decline registered by the “other” segment in 2013. In the long run, IC Insights believes that “other” companies will likely increase their spending at a lower rate, or decrease their spending at a higher rate, as compared to the top 10 companies as they implement the fabless or “fab-lite” business models for their IC production.
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